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CXL Memory Pooling Is the Next Architecture Shift in AI Data Centers

Compute Express Link, the open interconnect standard enabling processors to share memory across a high-speed fabric, is moving from specification to silicon. CXL version 3.1, ratified in late 2025, adds memory pooling, switching, and multi-host access that enable a fundamentally new approach to how AI workloads consume memory. Instead of each server containing fixed local…

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Samsung Prepares to Begin HBM4 Mass Production, Racing to Ship Before SK Hynix

Samsung Electronics is preparing to commence mass production of its sixth-generation high-bandwidth memory chips at its Pyeongtaek campus, with initial shipments to Nvidia and AMD expected as early as the third week of February. The milestone, reported by multiple Korean industry sources and corroborated by TrendForce, would make Samsung the first company globally to deliver…

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