Taiwan’s Semiconductor Sector Prepares for the Next Bottleneck: Advanced Packaging
For the better part of a decade, the global semiconductor conversation has revolved around one metric: transistor density. Whoever could print the smallest, most densely packed chips commanded the value chain. TSMC’s dominance in leading-edge fabrication, now pushing into 2-nanometer production, has been the defining competitive advantage of the AI hardware era. But the next…
